BGA & PCB INSPECTION SYSTEMS – IDENTIFY BALL GRID ARRAY AND PRINTED CIRCUIT BOARD PROBLEMS
BGA inspection (Ball Grid Array Inspection) is necessary to detect and isolate process defects between a chip and circuit board. BGA inspection looks for a variety of ball grid array problems during process development or the quality process.
PCB Inspection (Printed Circuit Board Inspection) or SMT Inspection (Surface Mount Technology Inspection) is necessary to detect and isolate process defects on the top of a circuit board.
Both BGA inspection and PCB inspection look for a variety of defects during process development or the quality process, including:
 |
Cracked Solder Joints |
|
Excess Flux |
|
BGA Separation |
|
Bridging |
|
Cold Solder Joints |
|
Solder Pads |
|
Contamination |
|
Empty and Open |
|
Improper Solder Paste Replacement |
|
Joint Cracking |
|
Ratcheting |
|
Non-Contact |
The VPI-Optical Inspection Systems are ideal for cost-effective, high-quality BGA inspection and PCB inspection. EasyBraid Co. Also offers BGA Software. Defects can be easily recognized by any operator with basic soldering and rework experience, even defects invisible with X-ray inspection.
View VPI Visual Inspection Technical Details
Download EasyBraid's Inspection Systems Catalog 492 kb pdf
|
