SPI 50T™
The optimal system for the solder paste printing process control
It is well known that defects of assembled PCBs are mainly related to the solder paste printing process. The trend
toward applying very small device such as 0201 chip and CSP spread widely beyond the SMT assembly industry, and
the lead free soldering exposures much more possibility of SMTA failures.
The SPI 50T is the most optimal off-line system for solder paste printing process monitoring and analysis. Its high
inspection speed makes SPI 50T accommodate a few SMT lines simultaneously.
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The most reliable 3D data and 100 % inspection |
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Authentic inspection and measurement |
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Fast teaching and easy operation |
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Monitor the printing process |
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3D shape viewer |
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Monitor printing status over all pads on the current PCB |
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Monitor printing status over the recent PCBs |
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Statistical Process Control |
Download brochure 512 kb pdf |
Contact us to learn more
about solder paste printing process monitoring and analysis
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11543 K-Tel Drive