SPI HS70 3D HIGH SPEED SOLDER PASTE INSPECTION SYSTEM:
Fast, Accurate, Reliable

The SPI HS70, with a highly improved 3D measuring performance, can guarantee zero false-call and escape-rate on high speed and finest component placement production lines. Along with various process analysis tools, it provides fast and accurate analysis and stabilization of the printing process.

The SPI HS70 sensor technology delivers the best Gage R&R capability, including 01005 chips and 150um CSP’s, while maintaining a cycle time of 80 cm2/sec.  The shadow-free dual laser technology means reliability in measuring height, area, volume, offset, bridge, warpage, and PCB shrinkage.

DUAL LASER PROJECTION
Unencumbered by cameras, its sensitivity to lighting conditions, mechanical fixturing and calibration, the dual laser technology is the new wave of 3D Solder Paste Inspection.  The speed and accuracy is proven and its implementation will ensure the fastest ROI.

REAL TIME WARP TRACKING
The true advantage of 3D is utilized to its fullest with the ability to have accurate reading of solder paste deposition, regardless of the warping or twisting of the PC board.  To do this on “the fly” without reducing the throughput keeps the process free from false reads and inaccurate information.

INTUITIVE MONITORING OF PRINTING STATUS

YIELD ENHANCING SPCworksPro SOFTWARE

80 CM2/SEC CYCLE TIME
Take Parmi by Easy Braid on a “speed run.” Lasers are the “speed of light.” Camera processing time and adjustments for lighting conditions aren’t required by the processor.  Combining the ultra fast RSCVI Sensor and soft travel of the laser heads enables this machine to give one of the fastest throughput rates in the industry.

SPI 2500™ HIGH PRECISION 3D SOLDER PASTE INSPECTOR

The SPI 2500 is the next generation of off-line solder paste inspection systems and features cost effective solutions with the greatest accuracy.

• Optimal solutions for monitoring and analysis of solder paste printing processes
• Measures Height, Volume and Area of solder paste with the utmost accuracy
• Suitable for checking CSP and fine pitch QFC paste locations.

To perform analysis and for monitoring roles in the solder paste printing process, the SPI 2500 embeds many useful tools and various measuring modes. The top quality 3D image provided by this system is by virtue of the high precision laser sensor resulting from PARMI's Research and Development and field experience.

The measuring process for height, area and volume is very simple. After placing a PCB on the working table, click the SCAN button.  The live image mode automates scanning the area shown in the live image viewer, and generates the 3D data.

SPC: Statistical Process Control, is the major role of this machine. Monitoring and controlling the printing process. The 3D shape modeled on the 3D viewer gives users meaningful information about the printing process.

Download brochure 2.6 mb pdf

SPI 50T™ THE OPTIMAL SYSTEM FOR SOLDER PASTE PRINTING PROCESS CONTROL

It is well known that defects of assembled PCBs are mainly related to the solder paste printing process. The trend toward applying very small devices such as the 0201 chip and CSP has spread widely, in the SMT assembly industry. And lead free soldering creates even more possibilities for SMTA failures.

The SPI 50T is the most optimal off-line system for solder paste printing process monitoring and analysis. Its high inspection speed allows the SPI 50T to accommodate multiple SMT lines simultaneously.

• The most reliable 3D data and 100% inspection
• Authentic inspection and measurement
• Fast teaching and easy operation

• 3D shape viewer
• Monitor printing status over all pads on the current PCB
• Monitor printing status over all recent PCBs

Statistical Process Control:

• X bar and X charts
• Moving range, range and Sigma charts
• Histogram chart
• Numeric display for process capability analysis
• Tolerance Settings

Download brochure 512 kb pdf

SPI HS60™ 3D SOLDER PASTE INSPECTION SYSTEM

Our innovative 3D laser triangulation sensor, the RSC®, profiles the true shape of features and also provides highly robust 3D data against considerable variations of PCB color and finishing condition, solder material, paste shape, and warpage. By virtue of the high profiling speed of the 3D sensor, the SPI HS60 system provides 100% whole pad inspection even in fast assembly lines. Our intelligent vision algorithm applied to the high quality 3D data detects every kind of solder paste defect. The measurable items are height, area, volume, and positional offset that deviate from tolerance limits. The algorithm also detects bridged pads in a very reliable manner.

The SPI HS60 also offers:

• Fast job change and easy operation
• Clear and prompt insight into printing process
• Defect verification and review

Download brochure 1.8 mb pdf